Highlights：High Performance High Reliability, High Scalability
Industrial-leading performance improves data center productivity
4 sockets of the 3rd Gen Intel®Xeon®Scalable
Processors
9 x single-slot wide GPU modules or 3 x double-slot wide GPU
24 x Intel ® Optane™ DC Persistent Memory Module(PMem 200)
Favorable Scalability and flexibility
Modular Design
Flexible 50 sff Drives
24 x NVME+M.2+MicroSD
18 x full height PCI-E 3.0 Slots+1 OCP3.0 slot
Enterprise-grade RAS
High RAS features
Redundant Components
Effective Security Design
TPM/TCM
Chassis Intrusion Detection
Silicon Root of Trust
|
CPU |
4 x 3rd generation Intel® Xeon® Cooper Lake SP series (Each processor up to 28 cores and maximum 250W power consumption) |
|
Chipset |
Intel® C621A |
|
Memory |
48 × DDR4 DIMM slots , maximum 12.0 TB* Up to 3200 MT/s data transfer rate and support for both RDIMM and LRDIMM Up to 24 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass) |
|
Storage controller |
Embedded RAID controller (SATA RAID 0, 1, 5, and 10) Standard PCIe HBA cards and storage controllers, depending on model |
|
FBWC |
8 GB DDR4 cache, depending on model , support supercapacitor protection |
|
Storage |
Maximum Front 50SFF, Support SAS/SATA HDD/SSD Drives Maximum 24 front U.2 NVMe Drives SATA M.2 SSDs/2 × SD cards , depending on model |
|
Network |
1 × onboard 1 Gbps management network port OCP 3.0 × 16 open slot to install 4 × 1GE copper ports/2 × 10GE/2 x 25GE fiber ports Standard PCIe 3.0 Ethernet Adapters PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet Adapter， |
|
PCIe slots |
18 × PCIe 3.0 FH standard slots |
|
Ports |
VGA connectors (Front and Rear) and serial port(RJ-45) 6 × USB 3.0 connectors (2 front, 2 rear, 2 internal) 1 dedicated management connector |
|
GPU |
9 × single-slot wide or 3 × double-slot wide GPU modules |
|
Optical drive |
External optical disk drive , Optional |
|
Management |
HDM (with dedicated management port) and H3C FIST, support LCD touchable smart model |
|
Security |
Intelligent Front Security Bezel * Support Chassis Intrusion Detection TPM2.0 Silicon Root of Trust Two-factor authorization logging |
|
Power supply |
Support 4 × Platinum 1600W*(supports 1+1/2+2 redundancy) , 800W –48V DC power supplies (1+1/2+2 redundancy) 8 × Hot swappable fans |
|
Power consumption |
Themaximumpowerconsumptionofthehostis655.2W(includingthemainboardandfanmodule,butexcludingoptionalcomponentssuchasCPUandmemory).Thepowerconsumptionvariesaccordingtodifferentconfigurations. |
|
Standards |
CE，UL , FCC，VCCI，EAC, etc. |
|
Operating temperature |
5°C to 45°C (41°F to 113°F) The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device. |
|
Dimensions (H × W × D) |
4U Height Without a security bezel: 174.8 × 447 × 799 mm (6.88 × 17.59 × 31.46 in) With a security bezel: 174.8 × 447 × 830 mm (6.88 × 17.59 × 32.67 in) |